| 1. | Silicone resin glass laminated sheets
有机硅层压玻璃布板 |
| 2. | Base materials for printed circuits - epoxide woven e - glass laminated sheet of defined flammability vertical burning test
印制电路基本材料.规定可燃性的环氧编织e型玻璃纤维叠层板材 |
| 3. | E materials for printed boards and other interconnecting structures - reinforced base materials , clad and unclad - modified non - halogenated epoxide woven e - glass laminated sheets of defined flammability vertical burning test , copper - clad
印制板和其他互连结构用材料.包被和非包被增强基材.阻燃型 |
| 4. | Materials for printed boards and other interconnecting structures - part 2 - 7 : reinforced base materials clad and unclad ; epoxide woven e - glass laminated sheet of defined flammability vertical burning test , copper - clad
印制板和其它互连结构用材料.第2 - 7部分:包被和非包被增强基材.规定了易燃性的环氧编织e级层压板 |
| 5. | Materials for interconnection structures - sectional specification set for reinforced base materials , clad and unclad - epoxide woven e - glass laminated sheet of defined flammability vertical burning test , copper - clad
互连结构件的材料.包层和非包层加强的基体材料的分规范.铜包层的环氧化物编织的e -玻璃叠层薄板材 |
| 6. | E materials for printed boards and other interconnecting structures - part 2 - 22 : reinforced base materials clad and unclad - modified non - halogenated epoxide woven e - glass laminated sheets of defined flammability vertical burning test , copper - clad
印制板和其他互连结构用材料.第2 - 22部分:包被和非包被增强基材.阻燃型 |
| 7. | E materials for printed boards and other interconnecting structures - part 2 - 22 : reinforced base materials , clad and unclad - modified non - halogenated epoxide woven e - glass laminated sheets of defined flammability vertical burning test , copper - clad
印制板和其他互连结构用材料.第2 - 22部分:包被和非包被增强基材.阻燃型 |
| 8. | Materials for printed boards and other interconnecting structures - part 2 - 7 : reinforced base materials clad and unclad - epoxide woven e - glass laminated sheet of defined flammability vertical burning test , copper - clad
印制电路板和其它互连结构件用材料.第2 - 7部分:包覆和非包覆的增强基材.规定易燃性的环氧编织e型玻璃纤维层压包铜薄板材 |
